Thermodynamic applications in material scienceSESTAK, JAROSLAV; STEPANEK, BEDRICH.Journal of thermal analysis. 1995, Vol 43, Num 2, issn 0368-4466, 183 p.Conference Proceedings

Calorimetry of building materialsTOMAN, J; CERNY, R.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 489-496, issn 0368-4466Conference Paper

Reactions between YBa₂Cu₃O_7-δ and La₂O₃ and SrCO₃HEGEDÜS, Z.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 461-468, issn 0368-4466Conference Paper

The comparison of the current and the enthalpy during cure of the compositionsVACULIK, L.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 513-516, issn 0368-4466Conference Paper

Binary alloys as a model for the multicultural societyMIMKES, J.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 521-537, issn 0368-4466Conference Paper

Calorimery in the science of building materialsUSHEROV-MARSHAK, A. V; SOPOV, V. P.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 497-504, issn 0368-4466Conference Paper

Differences in partial thermodynamic functions of some sections of systems Tl-Ag-Te and Tl-Sb-TeZALESKA, E; SZTUBA, Z; FUGLEWICZ, B et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 411-416, issn 0368-4466Conference Paper

Nonequilibrium phase diagrams in the PbCl₂-AgCl eutectic systemCHVOJ, Z; SESTAK, J; FENDRYCH, F et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 439-448, issn 0368-4466Conference Paper

Estimation of melting (decomposition) heat of some compounds in the Y-Ba-Cu-O systemMOISEEV, G; VATOLIN, N; SESTAK, J et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 477-488, issn 0368-4466Conference Paper

Materials engineering for optoelectronic crystals related to III-V compoundsVENKRBEC, J. J; KOUSAL, J.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 377-388, issn 0368-4466Conference Paper

Study of phase equilibria established up to the solidus line in the system Fe₂V₄O₁₃-WO₃WALCZAK, J; RYCHŁOWSKA-HIMMEL, I; MIKOS-NAWŁATYNA, E et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 427-431, issn 0368-4466Conference Paper

Comparative thermodynamic analysis of the binary system Bi-SbZIVKOVIC, Z. D; ZIVKOVIC, D; SESTAK, J et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 417-426, issn 0368-4466Conference Paper

Copper solubility and distribution in doped GaSb single crystalsSESTAK, J; STEPANEK, B; YOKOKAWA, H et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 389-397, issn 0368-4466Conference Paper

Thermochemical and thermodynamical properties of some compounds in the system Ga-Sb-SMOISEEV, G; SESTAK, J.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 539-544, issn 0368-4466Conference Paper

Application of the thermal analysis for detection of the resinoid bond influence on quality of the compositionsVACULIK, L.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 517-519, issn 0368-4466Conference Paper

Kinetic analysis of the process of thermal degradation of poly-N-vinylcarbazole and its derivativesPIELICHOWSKI, K.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 509-511, issn 0368-4466Conference Paper

Thermodynamic stability of phases in the Bi-Sr-Cu-(O) systemNEVRIVA, M; SEDMIDUBSKY, D.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 449-460, issn 0368-4466Conference Paper

Application of thermal analysis for the investigation of polymer degradation processesPIELICHOWSKI, J; PIELICHOWSKI, K.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 505-508, issn 0368-4466Conference Paper

Novel growth methods of optoelectronic crystals based on antimonidesVENKRBEC, J. J; KOUSAL, J; STETINA, J et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 399-410, issn 0368-4466Conference Paper

Phase equilibria in the system FeVO₄-Fe₂WO₆ in the solid stateWALCZAK, J; RYCHŁOWSKA-HIMMEL, I.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 433-438, issn 0368-4466Conference Paper

Estimation of average heat capacities of condensed phase transformation products in the Y-Ba-Cu-O systemMOISEEV, G; VATOLIN, N; STEPANEK, B et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 469-476, issn 0368-4466Conference Paper